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Western U.S. & Canada Sales Director - Industrial Smart Components
CEO
Description:
Speakers: Helen Barker, Industrial Smart Components Expert, HID & Neal Lober, CEO, FactorySense
Title: Mastering RFID in Manufacturing - Unlock Efficiency, Automation and Accuracy
Source: Think Wireless IoT Day 03-2024: Industry 4.0
Date: September 11th 2024
Content:
This webinar aims to provide an in-depth exploration of RFID technology and its crucial role in transforming manufacturing operations.
You’ll learn key considerations for RFID projects to successfully deliver on the technology’s promise, including:
How to master the essentials of successful RFID project implementation in manufacturing environments.
Why a well-defined use case drives not only technology and product selection but implementation timelines as well
How to avoid common pitfalls that can hinder the business’s ability to maximize operational efficiency and automation on the production line.
Best practices that will deliver visibility, predictability, and increased productivity to meet your manufacturing goals.
2 case studies for complex and large-scale RFID projects
What a good solid blueprint looks like for a manufacturing operation to be successful in deploying RFID from proof of concept all the way through a fully developed solution.
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Open standards and interoperable architectures based on OPC UA and CEN/CENELEC specifications form the foundation for scalable, cross-company EU Digital Product Passport implementations.
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Chipless RFID is a promising alternative to chip-based tags that can deliver scalable, cost-effective, and robust identification solutions for mass applications in logistics and industry.
July 01, 2026 RheinMain University of Applied Sciences
Effective implementation of Digital Product Passports requires comprehensive data management across value chains to transform regulatory demands into operational and strategic business advantages.
June 30, 2026 Fraunhofer ISST
Chipless RFID technology enables scalable and cost-effective identification through electromagnetic signatures, offering a promising alternative to silicon chip-based methods despite current technical challenges.
June 29, 2026 RheinMain University of Applied Sciences
Combining ultra-low-power hardware, energy harvesting, and interoperable standards is essential for creating sustainable, scalable Bluetooth LE connected devices.
June 23, 2026 EM Microelectronic
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