NXP Launches IW693 Wi-Fi 6E SoC: Advanced 2x2 Connectivity for Industrial IoT

  • Published: July 15, 2025
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NXP IW693 Wi-Fi 6E System-on-Chip providing advanced 2x2 connectivity for industrial IoT applications
NXP IW693 Wi-Fi 6E SoC – Advanced 2x2 dual-band solution delivering high-performance, reliable connectivity for Industrial IoT and smart edge applications. Source: NXP Semiconductors

NXP Semiconductors has announced the launch of its new IW693 Wi-Fi 6E System-on-Chip (SoC), delivering advanced, high-bandwidth wireless connectivity for industrial IoT (IIoT), commercial, and smart home applications.

As demand for reliable, high-speed, low-latency wireless communication grows in factories, warehouses, smart buildings, and connected homes, Wi-Fi congestion remains a challenge—especially in high-density environments with many devices competing for limited spectrum. Wi-Fi 6E expands connectivity into the 6 GHz band, providing more channels and less overlap for better performance and scalability.

The IW693 is NXP’s latest 2x2 dual-band Wi-Fi 6E + Bluetooth LE combo SoC, designed to address these challenges while simplifying system design for manufacturers.

Advanced Connectivity for IIoT and Edge Applications

The IW693 is purpose-built for demanding industrial and commercial settings that require robust, concurrent, multi-radio wireless connectivity. It supports concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth with four configurable radio modes, offering flexibility for diverse deployment scenarios:

  • Concurrent Dual Wi-Fi 2x2 Wi-Fi 6/6E (5–7 GHz) + 1x1 Wi-Fi 6 (2.4 GHz)

  • Concurrent Dual Wi-Fi 1x1 Wi-Fi 6/6E (5–7 GHz) + 1x1 Wi-Fi 6 (2.4 GHz)

  • 2x2 Wi-Fi 6 (2.4 GHz) only

  • 2x2 Wi-Fi 6/6E (5–7 GHz) only

With MU-MIMO, OFDMA, TWT (Target Wake Time), and Bluetooth LE Audio support, the IW693 enables high-efficiency, low-power, multi-stream communication—even in crowded networks.

Designed for Real-World Industrial Needs

Beyond its radio features, the IW693 integrates advanced hardware to simplify development:

  • Integrated 2.4 GHz and 5–7 GHz power amplifiers, low-noise amplifiers, and RF switches

  • Flexible antenna design supporting two or three antennas

  • External Wi-Fi front-end module (FEM) support

  • Interfaces including PCIe and SDIO for Wi-Fi, and UART for Bluetooth

  • Built-in coexistence management for Wi-Fi and Bluetooth on the same PCB

Security is critical for industrial systems. The IW693 includes NXP’s EdgeLock® Secure Enclave (Core Profile) for hardware-accelerated secure boot, firmware authentication, anti-rollback protection, and secure lifecycle management—helping developers meet demanding application-level security requirements.

Target Applications

The IW693 is ideal for a wide range of connected systems, including:

  • Wireless power-over-Ethernet hubs

  • Smart home hubs and mobile routers

  • IoT gateways

  • Industrial wireless connectivity

  • Video-enabled smart appliances

  • Wireless edge connectivity and visual smart home applications

  • Wireless medical systems

With extended operating temperature support (-40 °C to +85 °C) and high-integration design, the IW693 is well-suited for challenging industrial environments.

Enabling Faster Time to Market

To help developers reduce design complexity and accelerate time to market, NXP partners with module manufacturers to deliver certified modules based on the IW693 SoC. Certified modules are expected to be available starting in Q1 2026.

With the IW693, NXP is expanding its broad Wi-Fi 6E SoC portfolio—which also includes the automotive-grade AW693—into industrial IoT markets, giving manufacturers a powerful, future-ready platform for next-generation wireless products.

👉 Learn more about the IW693 Wi-Fi 6E SoC and start planning your next connectivity design: Visit NXP's IW693 page


Contact and Company information

Venis Kalderon Schmölder
Released by
NXP Semiconductors
Contact:
Venis Kalderon Schmölder

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